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? semiconductor components industries, llc, 2001 may, 2001 rev. 0 1 publication order number: nlast4501/d nlast4501 analog switch the nlast4501 is an analog switch manufactured in submicron silicongate cmos technology. it achieves very low r on while maintaining extremely low power dissipation. the device is a bilateral switch suitable for switching either analog or digital signals, which may vary from zero to full supply voltage. the nlast4501 is a low voltage, ttl (low threshold) compatible device, pin for pin compatible with the max4501. the enable pin is compatible with standard ttl level outputs when supply voltage is nominal 5.0 volts. it is also overvoltage tolerant, making it a very useful logic level translator. ? guaranteed r on of 32 at 5.5 v ? low power dissipation: i cc = 2 a ? low threshold enable pin ttl compatible at 5.0 volts ? ttl version and pin for pin with nlas4501 ? provides voltage translation for many different voltage levels 3.3 to 5.0 volts, enable pin may go as high as 5.5 volts 1.8 to 3.3 volts 1.8 to 2.5 volts ? improved version of max4501 (at any voltage between 2 and 5.5 volts) ? chip complexity: fets = 11 v+ com no in gnd figure 1. pinout (top view) 1 2 3 5 4 3 v cc http://onsemi.com function table see detailed ordering and shipping information on page 6 of this data sheet. ordering information l h on/off enable input state of analog switch off on sc88a / sot353/sc70 df suffix case 419a pin 1 d = date code ve d tsop5/sot23/sc59 dt suffix case 483 pin 1 d = date code ve d marking diagrams pin assignment pin 1 function com 2no 5 gnd 4 enable
nlast4501 http://onsemi.com 2 maximum ratings (note 1) symbol parameter value unit v cc positive dc supply voltage 0.5 to 7.0 v v in digital input voltage (enable) 0.5 to 7.0 v v is analog output voltage (v no or v com ) 0.5 to v cc 0.5 v i ik dc current, into or out of any pin 20 ma t stg storage temperature range 65 to 150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance sc88 tsop5 112 148 c/w p d power dissipation in still air at 85 c sc88 tsop5 500 450 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 30% 35% ul94vo (0.125 in) v esd esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4) > 2000 > 100 n/a v i latchup latchup performance above v cc and below gnd at 85 c (note 5) 300 ma 1. absolute maximum continuous ratings are those values beyond which damage to the device may occur. extended exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. functional operation under absolute maximumrated conditions is not implied. 2. tested to eia/jesd22a114a. 3. tested to eia/jesd22a115a. 4. tested to jesd22c101a. 5. tested to eia/jesd78. recommended operating conditions symbol parameter min max unit v cc positive dc supply voltage 2.0 5.5 v v in digital input voltage (enable) gnd 5.5 v v io static or dynamic voltage across an off switch gnd v cc v v is analog input voltage (no, com) gnd v cc v t a operating temperature range, all package types 55 125 c t r , t f input rise or fall time, v cc = 3.3 v 0.3 v (enable input) v cc = 5.0 v 0.5 v 0 0 100 20 ns/v device junction temperature versus time to 0.1% bond failures junction temperature c time, hours time, years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 failure rate of plastic = ceramic until intermetallics occur figure 2. failure rate vs. time junction temperature normalized failure rate time, years t j = 130 c t j = 120 c t j = 110 c t j = 100 c t j = 90 c t j = 80 c
nlast4501 http://onsemi.com 3 dc characteristics digital section (voltages referenced to gnd) guaranteed max limit symbol parameter condition v cc 55 c to 25 c 85 c 125 c unit v ih minimum highlevel input voltage, enable inputs 3.0 4.5 5.5 1.4 2.0 2.0 1.4 2.0 2.0 1.4 2.0 2.0 v v il maximum lowlevel input voltage, enable inputs 3.0 4.5 5.5 0.53 0.8 0.8 0.53 0.8 0.8 0.53 0.8 0.8 v i in maximum input leakage current, enable inputs v in = 5.5 v or gnd 0 v to 5.5 v 0.1 1.0 1.0 a i cc maximum quiescent supply current (per package) enable and vis = v cc or gnd 5.5 1.0 1.0 2.0 a dc electrical characteristics analog section guaranteed max limit symbol parameter condition v cc 55 c to 25 c 85 c 125 c unit r on maximum on resistance (figures 8 12) v in = v ih v is = v cc to gnd i is i = 10.0 ma 3.0 4.5 5.5 45 30 25 50 35 30 55 40 35 r flat(on) on resistance flatness v in = v ih i is i = 10.0 ma v is = 1 v, 2 v, 3.5 v 4.5 4 4 5 i no(off) no off leakage current (figure 3) v in = v il v no = 1.0 v or 4.5 v v com = 4.5 v or 1.0 v 5.5 1 10 100 na i com(off) com off leakage current (figure 3) v in = v il v no = 4.5 v or 1.0 v v com = 1.0 v or 4.5 v 5.5 1 10 100 na ac electrical characteristics (input t r = t f = 3.0 ns) guaranteed max limit v cc 55 c to 25 c 85 c 125 c symbol parameter test conditions (v) min typ max min typ max min typ max unit t on turnon time r l = 300 c l = 35 pf (figures 4, 5, and 13) 2.0 3.0 4.5 5.5 7.0 5.0 4.5 4.5 14 10 9 9 16 12 11 11 16 12 11 11 ns t off turnoff time r l = 300 c l = 35 pf (figures 4, 5, and 13) 2.0 3.0 4.5 5.5 11.0 7.0 5.0 5.0 22 14 10 10 24 16 12 12 24 16 12 12 ns typical @ 25, vcc = 5.0 v c in c no or c nc c com(off) c com(on) maximum input capacitance, select input analog i/o (switch off) common i/o (switch off) feedthrough (switch on) 8 10 10 20 pf
nlast4501 http://onsemi.com 4 additional application characteristics (voltages referenced to gnd unless noted) v cc limit symbol parameter condition v 25 c unit bw maximum onchannel 3db bandwidth or minimum frequency response v is = 0 dbm v is centered between v cc and gnd (figures 6 and 14) 3.0 4.5 5.5 190 200 220 mhz v onl maximum feedthrough on loss v is = 0 dbm @ 10 khz v is centered between v cc and gnd (figure 6) 3.0 4.5 5.5 2 2 2 db v iso offchannel isolation f = 100 khz; v is = 1 v rms v is centered between v cc and gnd (figures 6 and 15) 3.0 4.5 5.5 93 db q charge injection enable input to common i/o v is = v cc to gnd, f is = 20 khz t r = t f = 3 ns r is = 0 , c l = 1000 pf q = c l * v out (figures 7 and 16) 3.0 5.5 1.5 3.0 pc thd total harmonic distortion thd noise f is = 20 hz to 1 mhz, r l = rgen = 600 , c l = 50 pf v is = 3.0 v pp sine wave v is = 5.0 v pp sine wave (figure 17) 3.3 5.5 0.3 0.15 % 55 1.00e+03 5 1.00e01 15 35 leakage (pa) 1.00e04 figure 3. switch leakage vs. temperature 1.00e+05 i no(off) temperature ( c) 1.00e03 1.00e02 1.00e+00 1.00e+02 1.00e+04 25 45 1.00e05 1.00e06 1.00e07 1.00e+01 65 85 105 125 145 i com(on) i com(off)
nlast4501 http://onsemi.com 5 figure 4. t on /t off 50% 50% 90% 90% t on t off v oh output input v cc 0 v figure 5. t on /t off dut no 35 pf v cc input 50% 50% 10% t on t off output input v cc 0 v 10% 300 com v ol v out v oh v ol dut no v cc input com 300 35 pf v out 0.1 f
nlast4501 http://onsemi.com 6 channel switch control/s test socket is normalized. off isolation is measured across an off channel. on loss is the bandwidth of an on switch. v iso , bandwidth and v onl are independent of the input signal direction. v iso = off channel isolation = 20 log for v in at 100 khz v onl = on channel loss = 20 log for v in at 100 khz to 50 mhz bandwidth (bw) = the frequency 3 db below v onl no dut com 50 50 generator reference transmitted figure 6. off channel isolation/on channel loss (bw)/crosstalk (on channel to off channel)/v onl v out v in v out v in off on off d v out v cc gnd output v in c l dut figure 7. charge injection: (q) v in no com
nlast4501 http://onsemi.com 7 35.0 30.0 20.0 25.0 15.0 10.0 0.0 35 20 40 15 25 0 45 12 0 60 0.6 30 0.4 0.2 r on ( w ) 0 v com (volts) figure 8. r on vs. v com and v cc (@25 c) figure 9. r on vs. v com and temperature, v cc = 2.0 v r on ( w ) 0 30 25 20 15 1.2 0.9 0.6 10 5 0 0.3 1.5 1.8 3 figure 10. r on vs. v com and temperature, v cc = 2.5 v v com (volts) figure 11. r on vs. v com and temperature, v cc = 3.0 v v com (volts) r on ( w ) r on ( w ) figure 12. r on vs. v com and temperature, v cc = 4.5 v v cc (v) time (ns) 80 2.0 5.5 5.0 4.5 3.0 0 0.2 2.4 0 1.6 2 1.2 0.8 2.4 0.4 2.8 8 14 6 10 0 16 18 55 c t on v is (volts) 10 20 40 50 70 12 10 0.8 1.2 1.4 1.6 1.8 5 30 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.1 2.4 2.7 4 2 3.2 3.6 4 4.4 5.0 25 c 85 c 125 c 55 c 25 c 85 c 125 c t off 55 c 25 c 85 c 125 c 55 c 25 c 85 c 125 c 0 2 2.5 1.5 13 0.5 3.5 4 4.5 5 v cc = 2.0 v cc = 2.5 v cc = 3.0 v cc = 4.5 20 30 10 0 40 50 60 70 80 v com (volts) r on ( w ) 0 0.6 0.4 0.2 r on ( w ) 55 c v is (volts) 12 0.8 1.2 1.4 1.6 1.8 25 c 85 c 125 c figure 13. switching time vs. supply voltage, t = 25 c
nlast4501 http://onsemi.com 8 1.20 0.80 1.40 0.60 1.00 0.00 1.60 10 0 10 1 100 off isolation (db/div) v com (v) figure 14. on channel bandwidth and phase shift over frequency figure 15. off channel isolation q (pc) 10 100 10 100000 10000 1000 1 0.1 0.01 100 1000000 figure 16. charge injection vs. v com frequency (hz) thd (%) 0.0 3.0 5.0 frequency (mhz) 100 300 0.40 0.20 1.0 2.0 3.6 4.0 4.5 v cc = 3.0 v 5.5 v 3.3 v v cc = 5.0 v 10 0 figure 17. thd vs. frequency frequency (mhz) bandwidth (db/div) 10 100 10 1 300 100 phase (degrees) 0 5 bandwidth (on loss) phase (degrees) v cc = 5.0 v ta = 25 c v cc = 5.0 v ta = 25 c 100 50
nlast4501 http://onsemi.com 9 device ordering information device nomenclature device order number circuit indicator temp range identifier technology device function package suffix tape & reel suffix package type (name/sot#/ common name) tape & reel size NLAST4501Dft2 nlas 74 vhc1g 66 df t2 sc88a/ sot353/ sc70 178 mm (7 in) 3000 unit NLAST4501Dtt1 nlas 74 vhc1g 66 dt t1 tsops/ sot23/ sc59 178 mm (7 in) 3000 unit
nlast4501 http://onsemi.com 10 figure 18. carrier tape specifications d 1 for components 10 pitches cumulative tolerance on tape 0.2 mm ( 0.008 in) 2.0 mm 1.2 mm and larger center lines of cavity embossment user direction of feed k 0 see note 7 p 0 p 2 d e f w b 0 + + + k t b 1 top cover tape p see note 7 a 0 for machine reference only including draft and radii concentric around b 0 r min tape and components shall pass around radius aro without damage bending radius *top cover tape thickness (t 1 ) 0.10 mm (0.004 in) max embossed carrier embossment typical component cavity center line typical component center line maximum component rotation 10 camber (top view) allowable camber to be 1 mm/100 mm nonaccumulative over 250 mm 100 mm (3.937 in) 1 mm (0.039 in) max 250 mm (9.843 in) 1 mm max tape embossed carrier dimensions (see notes 6 and 7) tape size b 1 max d d 1 e f k p p 0 p 2 r t w 8 mm 4.35 mm (0.171 in) 1.5 0.1/ 0.0 mm (0.059 0.004/ 0.0 in) 1.0 mm min (0.039 in) 1.75 0.1 mm (0.069 0.004 in) 3.5 0.5 mm (1.38 0.002 in) 2.4 mm (0.094 in) 4.0 0.10 mm (0.157 0.004 in) 4.0 0.1 mm (0.156 0.004 in) 2.0 0.1 mm (0.079 0.002 in) 25 mm (0.98 in) 0.3 0.05 mm (0.01 0.0038/ 0.0002 in) 8.0 0.3 mm (0.315 0.012 in) 6. metric dimensions governenglish are in parentheses for reference only. 7. a 0 , b 0 , and k 0 are determined by component size. the clearance between the components and the cavity must be within 0.05 mm min to 0.50 mm max. the component cannot rotate more than 10 within the determined cavity.
nlast4501 http://onsemi.com 11 figure 19. reel dimensions 13.0 mm 0.2 mm (0.512 in 0.008 in) 1.5 mm min (0.06 in) 50 mm min (1.969 in) 20.2 mm min (0.795 in) full radius t max g a reel dimensions tape size t&r suffix a max g t max 8 mm t1, t2 178 mm (7 in) 8.4 mm, +1.5 mm, 0.0 (0.33 in + 0.059 in, 0.0) 14.4 mm (0.56 in) figure 20. reel winding direction direction of feed barcode label hole pocket
nlast4501 http://onsemi.com 12 tape trailer (connected to reel hub) no components 160 mm min tape leader no components 400 mm min components direction of feed cavity tape top tape figure 21. tape ends for finished goods figure 22. dft2 (sc88a) reel configuration/orientation user direction of feed at1o pin one away from sprocket hole user direction of feed at2o pin one away from sprocket hole figure 23. dtt1 (tsop5) reel configuration/orientation
nlast4501 http://onsemi.com 13 package dimensions sc88a/sot353/sc70 df suffix 5lead package case 419a01 issue e notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 v 0.30 0.40 0.012 0.016 b 0.2 (0.008) mm 123 4 5 a g v s d 5 pl h c n j k b 0.5 mm (min) 0.4 mm (min) 0.65 mm 0.65 mm 1.9 mm
nlast4501 http://onsemi.com 14 package dimensions tsop5/sot23/sc59 dt suffix 5lead package case 48301 issue a notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. dim min max min max inches millimeters a 2.90 3.10 0.1142 0.1220 b 1.30 1.70 0.0512 0.0669 c 0.90 1.10 0.0354 0.0433 d 0.25 0.50 0.0098 0.0197 g 0.85 1.00 0.0335 0.0413 h 0.013 0.100 0.0005 0.0040 j 0.10 0.26 0.0040 0.0102 k 0.20 0.60 0.0079 0.0236 l 1.25 1.55 0.0493 0.0610 m 0 10 0 10 s 2.50 3.00 0.0985 0.1181 0.05 (0.002) 123 54 s a g l b d h c k m j mm inches 1.9 0.039 1.0 0.094 0.7 0.074 2.4 0.028 0.95 0.037 0.95 0.037
nlast4501 http://onsemi.com 15 notes
nlast4501 http://onsemi.com 16 on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information central/south america: spanish phone : 3033087143 (monfri 8:00am to 5:00pm mst) email : onlitspanish@hibbertco.com tollfree from mexico: dial 018002882872 for access then dial 8662979322 asia/pacific : ldc for on semiconductor asia support phone : 13036752121 (tuefri 9:00am to 1:00pm, hong kong time) toll free from hong kong & singapore: 00180044223781 email : onlitasia@hibbertco.com japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. nlast4501/d north america literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com fax response line: 3036752167 or 8003443810 toll free usa/canada n. american technical support : 8002829855 toll free usa/canada europe: ldc for on semiconductor european support german phone : (+1) 3033087140 (monfri 2:30pm to 7:00pm cet) email : onlitgerman@hibbertco.com french phone : (+1) 3033087141 (monfri 2:00pm to 7:00pm cet) email : onlitfrench@hibbertco.com english phone : (+1) 3033087142 (monfri 12:00pm to 5:00pm gmt) email : onlit@hibbertco.com european tollfree access*: 0080044223781 *available from germany, france, italy, uk, ireland

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